Invention Grant
- Patent Title: Front end module
- Patent Title (中): 前端模块
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Application No.: US11518165Application Date: 2006-09-11
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Publication No.: US07768792B2Publication Date: 2010-08-03
- Inventor: Kyung Joon Kim , Hyoung Ki Nam , Won Gyu Lee
- Applicant: Kyung Joon Kim , Hyoung Ki Nam , Won Gyu Lee
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2005-0084895 20050912; KR10-2005-0084995 20050913; KR10-2005-0085600 20050914; KR10-2005-0085955 20050914; KR10-2005-0086888 20050916; KR10-2005-0128429 20051223; KR10-2005-0129850 20051226; KR10-2005-0129852 20051226
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10
Abstract:
A front end module includes a multilayered structure. The multilayered structure includes a transmitter, a receiver, and a duplex unit. The multilayered structure further includes a ground layer. The ground layer includes a ground pattern having at least one block on a surface of a substrate of the front end module.
Public/Granted literature
- US20070058748A1 Front end module Public/Granted day:2007-03-15
Information query
