Invention Grant
- Patent Title: Die module system
- Patent Title (中): 模块模块系统
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Application No.: US12147218Application Date: 2008-06-26
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Publication No.: US07768796B2Publication Date: 2010-08-03
- Inventor: James W. Cady , Paul Goodwin
- Applicant: James W. Cady , Paul Goodwin
- Applicant Address: US TX Austin
- Assignee: Entorian Technologies L.P.
- Current Assignee: Entorian Technologies L.P.
- Current Assignee Address: US TX Austin
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.
Public/Granted literature
- US20080278924A1 DIE MODULE SYSTEM Public/Granted day:2008-11-13
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