Invention Grant
- Patent Title: Component accommodating case and electronic apparatus
- Patent Title (中): 组件容纳盒和电子设备
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Application No.: US11567642Application Date: 2006-12-06
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Publication No.: US07768798B2Publication Date: 2010-08-03
- Inventor: Munetoyo Aono , Naoyuki Fujimori
- Applicant: Munetoyo Aono , Naoyuki Fujimori
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2005-352923 20051207
- Main IPC: B41J29/13
- IPC: B41J29/13 ; H05K5/00 ; H05K1/00 ; H05K7/00 ; H05K9/00
Abstract:
A component accommodating case for accommodating an electronic component that is connected to a wire includes a cutout portion that passes the wire therethrough, an external case that covers at least a surface where the cutout portion is disposed, and a plate member that covers the cutout portion and that is mounted to the external case.
Public/Granted literature
- US20070127203A1 COMPONENT ACCOMMODATING CASE AND ELECTRONIC APPARATUS Public/Granted day:2007-06-07
Information query
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