Invention Grant
US07769355B2 System-in-package wireless communication device comprising prepackaged power amplifier
有权
系统级封装无线通信设备，包括预包装功率放大器
- Patent Title: System-in-package wireless communication device comprising prepackaged power amplifier
- Patent Title (中): 系统级封装无线通信设备，包括预包装功率放大器
-
Application No.: US11152308Application Date: 2005-06-14
-
Publication No.: US07769355B2Publication Date: 2010-08-03
- Inventor: Ikuroh Ichitsubo , Kanya Kubota , Wen Chung Liu
- Applicant: Ikuroh Ichitsubo , Kanya Kubota , Wen Chung Liu
- Applicant Address: US CA Palo Alto
- Assignee: Micro Mobio Corporation
- Current Assignee: Micro Mobio Corporation
- Current Assignee Address: US CA Palo Alto
- Agent Xin Wen
- Main IPC: H01Q11/12
- IPC: H01Q11/12 ; H04B1/04
Abstract:
A substantially rectangular shaped power amplifier module includes a power amplifier for amplifying radio frequency signals, a bias control terminal and a power sensing terminal disposed on the same side of the power amplifier module, an input terminal and a ground terminal disposed on the same side of the power amplifier module, and an output terminal and one or more power supply terminals disposed on the same side of the power amplifier module.
Public/Granted literature
- US20060160504A1 System-in-package wireless communication device comprising prepackaged power amplifier Public/Granted day:2006-07-20
Information query
