发明授权
- 专利标题： Bi-directional wafer transfer mechanism and method
- 专利标题（中）： 双向晶片转印机构及方法
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申请号： US10034788申请日： 2001-12-27
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公开(公告)号： US07771157B2公开(公告)日： 2010-08-10
- 发明人: Curtis E. Farrell , Dennis D. Liu
- 申请人： Curtis E. Farrell , Dennis D. Liu
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： B65G65/34
- IPC分类号： B65G65/34
摘要：
A wafer transfer machine transfers wafers from either of a first wafer cassette (55) and a second wafer cassette (56) having incompatible registration features into the other, and includes a support plate (30) having a top surface (38) for supporting the first and second wafer cassette. A first and second registration bosses attached to the top surface extend upward into registration features of the first and second wafer cassette, respectively. A carriage (1) is supported by and movable in opposite directions along a track mechanism (41A,B) that is attached in fixed relationship to the support plate (30). First and second wafer pushing members (10A,B) are supported by the carriage. Each wafer pushing member can be moved to push wafers in one of the wafer cassettes into the other by moving the carriage in one direction or the other.
公开/授权文献
- US20030123963A1 Bi-directional wafer transfer mechanism and method 公开/授权日：2003-07-03