发明授权
- 专利标题: Electrical connecting apparatus
- 专利标题(中): 电气连接装置
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申请号: US12580938申请日: 2009-10-16
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公开(公告)号: US07771220B2公开(公告)日: 2010-08-10
- 发明人: Eichi Osato , Yoshihito Goto , Mitsuhiro Abe
- 申请人: Eichi Osato , Yoshihito Goto , Mitsuhiro Abe
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Nihon Micronics
- 当前专利权人: Kabushiki Kaisha Nihon Micronics
- 当前专利权人地址: JP Tokyo
- 代理机构: Graybeal Jackson LLP
- 代理商 Bryan A. Santarelli
- 优先权: JP2008-269667 20081020
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
An embodiment of an electrical connecting apparatus comprises an electrical insulating plate, an elastic plate made of an electrical insulating material arranged on the electrical insulating plate, a sheet-like conductive plate arranged on the elastic plate, and first and second contacts. The conductive plate comprises a hole area having at least one first hole portion allowing the probe tip portion of the first contact to abut to the conductive plate and a plurality of second hole portions not allowing the probe tip portions of the second contacts to abut thereon regardless of whether or not overdriving acts on the contacts.
公开/授权文献
- US20100099277A1 ELECTRICAL CONNECTING APPARATUS 公开/授权日:2010-04-22
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