Invention Grant
- Patent Title: Arrangements of fuse-type constructions
- Patent Title (中): 保险丝型结构的安排
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Application No.: US11207116Application Date: 2005-08-18
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Publication No.: US07772680B2Publication Date: 2010-08-10
- Inventor: H. Montgomery Manning
- Applicant: H. Montgomery Manning
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/62
Abstract:
The invention includes semiconductor fuse arrangements containing an electrically conductive plate over and in electrical contact with a plurality of electrically conductive links. Each of the links contacts the electrically conductive plate as a separate region relative to the other links, and the region where a link makes contact to the electrically conductive plate is a fuse. The invention also includes methods of forming semiconductor fuse arrangements.
Public/Granted literature
- US20060038256A1 Semiconductor fuse arrangements Public/Granted day:2006-02-23
Information query
IPC分类:
