发明授权
- 专利标题: Semiconductor device manufacturing method
- 专利标题(中): 半导体器件制造方法
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申请号: US12627941申请日: 2009-11-30
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公开(公告)号: US07776659B2公开(公告)日: 2010-08-17
- 发明人: Hiroyuki Ogawa , Hideyuki Kojima
- 申请人: Hiroyuki Ogawa , Hideyuki Kojima
- 申请人地址: JP Yokohama
- 专利权人: Fujitsu Semiconductor Limited
- 当前专利权人: Fujitsu Semiconductor Limited
- 当前专利权人地址: JP Yokohama
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2008-306677 20081201
- 主分类号: H01L21/82
- IPC分类号: H01L21/82
摘要:
A method of manufacturing a semiconductor device having a first memory cell array region and a second memory cell array region, the method includes forming an active region on a surface layer of a semiconductor substrate, forming a first word line extending in a first direction on the gate insulating film in the first memory cell array region, and forming a second word line extending in a second direction crossing the first direction on the gate insulating film in the second memory cell array region, wherein the ion implantation into the active region is performed from a direction that is inclined from a direction vertical to the surface of the semiconductor substrate and is oblique with respect to both the first direction and the second direction.
公开/授权文献
- US20100136758A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 公开/授权日:2010-06-03
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