发明授权
US07777310B2 Integrated circuit package system with integral inner lead and paddle
有权
集成电路封装系统，内置内部引线和桨
- 专利标题： Integrated circuit package system with integral inner lead and paddle
- 专利标题（中）： 集成电路封装系统，内置内部引线和桨
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申请号： US11670862申请日： 2007-02-02
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公开(公告)号： US07777310B2公开(公告)日： 2010-08-17
- 发明人: Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho , Arnel Trasporto
- 申请人： Jeffrey D. Punzalan , Henry Descalzo Bathan , Zigmund Ramirez Camacho , Arnel Trasporto
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package system is provided including forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.
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