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发明授权
US07777314B2 Electronic component mounting package and package assembled substrate 有权
电子元件安装封装和封装组装基板

Electronic component mounting package and package assembled substrate
摘要：
A package of the present invention has a laminate structure formed by laminating a plurality of ceramic layers, and has a mount surface to be a joint surface when mounted on a mother board, defined parallel with the laminating direction. A first ceramic layer has a recess with an L-shaped cross section across the mount surface and a side surface, defined at each end thereof in a direction perpendicular to the laminating direction, and an external electrode formed on each recess, the external electrode having a surface thereof exposed to the mount surface.
摘要（中）：

本发明的封装具有通过层叠多个陶瓷层而形成的层叠结构，并且在与层叠方向平行地限定在安装在母板上时具有作为接合面的安装面。 第一陶瓷层具有穿过安装表面的L形横截面的凹部和在其每个端部沿与层叠方向垂直的方向限定的侧表面和形成在每个凹部上的外部电极，所述外部电极具有 其表面暴露于安装表面。

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