Invention Grant
- Patent Title: Capacitor structure and method of manufacturing the same
- Patent Title (中): 电容器结构及其制造方法
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Application No.: US11983991Application Date: 2007-11-13
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Publication No.: US07778008B2Publication Date: 2010-08-17
- Inventor: Keun-Bong Lee , Jung-Hyeon Kim
- Applicant: Keun-Bong Lee , Jung-Hyeon Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2006-0116352 20061123
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/06

Abstract:
In a capacitor structure and a method of manufacturing the capacitor structure, first and second conductive patterns are formed on a substrate. The first and second conductive patterns extend in a first direction. The first and second conductive patterns are alternately arranged to be spaced apart from one another in a second direction substantially perpendicular to the first direction. An insulating interlayer is formed on the substrate to cover the first and second conductive patterns. Third and fourth conductive patterns extending in a third direction lying at an angle of between about 0° and about 90° relative to the first direction are formed on the insulating interlayer. The third and fourth conductive patterns are alternately arranged to be spaced apart from one another in a fourth direction substantially perpendicular to the third direction.
Public/Granted literature
- US20080123244A1 Capacitor structure and method of manufacturing the same Public/Granted day:2008-05-29
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