Invention Grant
- Patent Title: Composite modular barrier structures and packages
- Patent Title (中): 复合模块化屏障结构和封装
-
Application No.: US10838701Application Date: 2004-05-04
-
Publication No.: US07781034B2Publication Date: 2010-08-24
- Inventor: Angelo Yializis , Michael G. Mikhael
- Applicant: Angelo Yializis , Michael G. Mikhael
- Applicant Address: US AZ Tucson
- Assignee: Sigma Laboratories of Arizona, LLC
- Current Assignee: Sigma Laboratories of Arizona, LLC
- Current Assignee Address: US AZ Tucson
- Agent Antonio R. Durando
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B32B27/08 ; B32B9/00 ; B32B9/04 ; B32B17/06

Abstract:
A composite multi-layer barrier is produced by first vapor depositing a barrier under vacuum over a substrate and then depositing an additional barrier at atmospheric pressure in a preferably thermoplastic layer. The resulting multi-layer barrier is used to coat an article in a lamination process wherein the thermoplastic layer is fused onto itself and the surface of the article. The vacuum-deposited barrier may include of a first leveling polymer layer followed by an inorganic barrier material sputtered over the leveling layer and of an additional polymeric layer flash evaporated, deposited, and cured under vacuum. The thermoplastic polymeric layer is then deposited by extrusion, drawdown or roll coating at atmospheric pressure. The resulting multi-layer barrier may be stacked using the thermoplastic layer as bonding agent. Nano-particles may be included in the thermoplastic layer to improve barrier properties. A desiccant material may also be included or added as a separate layer.
Public/Granted literature
- US20050249901A1 Composite modular barrier structures and packages Public/Granted day:2005-11-10
Information query