发明授权
- 专利标题: Active device array substrate and method for fabricating the same
- 专利标题(中): 有源器件阵列衬底及其制造方法
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申请号: US12190887申请日: 2008-08-13
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公开(公告)号: US07781776B2公开(公告)日: 2010-08-24
- 发明人: Kuo-Lung Fang , Hsiang-Lin Lin , Han-Tu Lin
- 申请人: Kuo-Lung Fang , Hsiang-Lin Lin , Han-Tu Lin
- 申请人地址: TW Hsinchu
- 专利权人: AU Optronics Corp.
- 当前专利权人: AU Optronics Corp.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Thomas, Kayden, Horstemeyer & Risley
- 优先权: TW97113250A 20080411
- 主分类号: H01L21/30
- IPC分类号: H01L21/30
摘要:
An active device array substrate and its fabricating method are provided. According to the subject invention, the elements of an array substrate such as the thin film transistors, gate lines, gate pads, data lines, data pads and storage electrodes, are provided by forming a patterned first metal layer, an insulating layer, a patterned semiconductor layer and a patterned metal multilayer. Furthermore, the subject invention uses the means of selectively etching certain layers. Using the aforesaid means, the array substrate of the subject invention has some layers with under-cut structures, and thus, the number of the time-consuming and complicated mask etching process involved in the production of an array substrate can be reduced. The subject invention provides a relatively simple and time-saving method for producing an array substrate.
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