发明授权
- 专利标题： Electronic device manufacturing chamber method
- 专利标题（中）： 电子装置制造室法
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申请号： US11214475申请日： 2005-08-29
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公开(公告)号： US07784164B2公开(公告)日： 2010-08-31
- 发明人: John M. White , Donald Verplancken , Shinichi Kurita
- 申请人： John M. White , Donald Verplancken , Shinichi Kurita
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Dugan & Dugan, PC
- 主分类号： B23P11/00
- IPC分类号： B23P11/00
摘要：
A non-polygon shaped, multi-piece chamber is provided. A non-polygon shaped, multi-piece chamber may include (1) a central piece having a first side and a second side, (2) a first side piece adapted to couple with the first side of the central piece, and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece, and the second side piece form a cylindrical overall shape when coupled together. Numerous other aspects are provided.
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