An apparatus for providing electrical pathways between one or more unsingulated integrated circuits and one or more test circuits external to the integrated circuits, includes a flexible substrate having a first major surface and a second major surface, a plurality of first contact structures disposed in a central portion of the first surface of the flexible substrate, a plurality of second contact structures disposed in a peripheral annular region of the first surface of the flexible substrate, and a plurality of first electrically conductive pathways, each of the plurality of first electrically conductive pathways coupled to a respective first and second contact structure, wherein the second surface is free from first contact structures, second contact structures, and first electrically conductive pathways.