发明授权
- 专利标题: Method for producing chemical mechanical polishing pad
- 专利标题(中): 化学机械抛光垫的生产方法
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申请号: US12253349申请日: 2008-10-17
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公开(公告)号: US07790788B2公开(公告)日: 2010-09-07
- 发明人: Yukio Hosaka , Rikimaru Kuwabara
- 申请人: Yukio Hosaka , Rikimaru Kuwabara
- 申请人地址: JP Tokyo
- 专利权人: JSR Corporation
- 当前专利权人: JSR Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 主分类号: D21H19/58
- IPC分类号: D21H19/58 ; C08B37/02 ; B24D11/00
摘要:
There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy.A chemical mechanical polishing pad produced by the above method has advantages that it is excellent in removal rate and scratches and in-plane uniformity on a polished surface and that it shows a stable removal rate even when polishing a number of objects to be polished successively.
公开/授权文献
- US20090104856A1 METHOD FOR PRODUCING CHEMICAL MECHANICAL POLISHING PAD 公开/授权日:2009-04-23