发明授权
US07791058B2 Enhanced memory density resistance variable memory cells, arrays, devices and systems including the same, and methods of fabrication 有权
增强的存储密度电阻可变存储器单元,阵列,包括其的器件和系统以及制造方法

  • 专利标题: Enhanced memory density resistance variable memory cells, arrays, devices and systems including the same, and methods of fabrication
  • 专利标题(中): 增强的存储密度电阻可变存储器单元,阵列,包括其的器件和系统以及制造方法
  • 申请号: US12491911
    申请日: 2009-06-25
  • 公开(公告)号: US07791058B2
    公开(公告)日: 2010-09-07
  • 发明人: Jun Liu
  • 申请人: Jun Liu
  • 申请人地址: US ID Boise
  • 专利权人: Micron Technology, Inc.
  • 当前专利权人: Micron Technology, Inc.
  • 当前专利权人地址: US ID Boise
  • 代理机构: Dickstein Shapiro LLP
  • 主分类号: H01L29/02
  • IPC分类号: H01L29/02 H01L21/00
Enhanced memory density resistance variable memory cells, arrays, devices and systems including the same, and methods of fabrication
摘要:
A resistance variable memory cell and method of forming the same. The memory cell includes a first electrode and at least one layer of resistance variable material in contact with the first electrode. A first, second electrode is in contact with a first portion of the at least one layer of resistance variable material and a second, second electrode is in contact with a second portion of the at least one layer of resistance variable material.
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