发明授权
- 专利标题: Semiconductor device and method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12026593申请日: 2008-02-06
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公开(公告)号: US07791171B2公开(公告)日: 2010-09-07
- 发明人: Mitsuru Soma , Hirotsugu Hata , Yoshimasa Amatatsu
- 申请人: Mitsuru Soma , Hirotsugu Hata , Yoshimasa Amatatsu
- 申请人地址: JP Osaka JP Gunma
- 专利权人: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- 当前专利权人地址: JP Osaka JP Gunma
- 代理机构: Fish & Richardson P.C.
- 优先权: JP2007-030797 20070209; JP2008-006276 20080115
- 主分类号: H01L27/082
- IPC分类号: H01L27/082 ; H01L27/102 ; H01L29/70 ; H01L31/11
摘要:
In a semiconductor device according to the present invention, two epitaxial layers are formed on a P type substrate. In the substrate and the epitaxial layers, isolation regions are formed to divide the substrate and the epitaxial layers into a plurality of islands. Each of the isolation regions is formed by connecting first and second P type buried layers with a P type diffusion layer. By disposing the second P type buried layer between the first P type buried layer and the P type diffusion layer, a lateral diffusion width of the first P type buried layer is reduced. By use of this structure, a formation region of the isolation region is reduced in size.
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