发明授权
US07791193B2 Pad over active circuit system and method with meshed support structure
有权
覆盖有源电路系统和网格支持结构的方法
- 专利标题： Pad over active circuit system and method with meshed support structure
- 专利标题（中）： 覆盖有源电路系统和网格支持结构的方法
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申请号： US11943381申请日： 2007-11-20
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公开(公告)号： US07791193B2公开(公告)日： 2010-09-07
- 发明人: Inderjit Singh , Howard Lee Marks , Joseph David Greco
- 申请人： Inderjit Singh , Howard Lee Marks , Joseph David Greco
- 申请人地址： US CA Santa Clara
- 专利权人： NVIDIA Corporation
- 当前专利权人： NVIDIA Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Zilka-Kotab, PC
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.
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