发明授权
US07792396B2 Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use
有权
用于测试晶片内光子集成电路(PIC)的探针卡和使用方法
- 专利标题: Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use
- 专利标题(中): 用于测试晶片内光子集成电路(PIC)的探针卡和使用方法
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申请号: US10990042申请日: 2004-11-16
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公开(公告)号: US07792396B2公开(公告)日: 2010-09-07
- 发明人: Fred A. Kish, Jr. , Frank H. Peters , Radhakrishnan L. Nagarajan , Richard P. Schneider
- 申请人: Fred A. Kish, Jr. , Frank H. Peters , Radhakrishnan L. Nagarajan , Richard P. Schneider
- 申请人地址: US CA Sunnyvale
- 专利权人: Infinera Corporation
- 当前专利权人: Infinera Corporation
- 当前专利权人地址: US CA Sunnyvale
- 代理商 W. Douglas Carothers, Jr.; David L. Soltz
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; G01R31/02
摘要:
Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface electrical contacts. The probe card has a probe card body with at least one row of downwardly dependent, electrically conductive contact probes. The probe body is transversely translated over the surface of the wafer to a selected in-wafer photonic integrated circuit (PIC) die. Then, the contact probes of the probe card are brought into engagement with surface electrical contacts of the selected photonic integrated circuit (PIC) die for testing the operation of electro-optic components in the selected in-wafer photonic integrated circuit (PIC) die.