发明授权
- 专利标题： Method for making camera modules and camera module made thereby
- 专利标题（中）： 由此制造相机模块和相机模块的方法
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申请号： US12292184申请日： 2008-11-13
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公开(公告)号： US07795066B2公开(公告)日： 2010-09-14
- 发明人: Chia-Hsi Tsai , Cheng-Te Tseng , Tzu-Kan Chen , Yi-Ting Lin
- 申请人： Chia-Hsi Tsai , Cheng-Te Tseng , Tzu-Kan Chen , Yi-Ting Lin
- 申请人地址： CN Guangzhou TW Taipei
- 专利权人： Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology
- 当前专利权人： Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology
- 当前专利权人地址： CN Guangzhou TW Taipei
- 代理机构： Rosenberg, Klein & Lee
- 优先权： CN200810029455 20080710
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.