发明授权
- 专利标题： Thermal management system and associated method
- 专利标题（中）： 热管理系统及相关方法
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申请号： US11247113申请日： 2005-10-11
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公开(公告)号： US07797808B2公开(公告)日： 2010-09-21
- 发明人: Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
- 申请人： Jian Zhang , Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda
- 申请人地址： US NY Niskayuna
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： US NY Niskayuna
- 代理商 Andrew J. Caruso
- 主分类号： B23P25/00
- IPC分类号： B23P25/00 ; B32B17/10
摘要：
A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.
公开/授权文献
- US20070240310A1 Thermal management system and associated method 公开/授权日：2007-10-18
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