Invention Grant
- Patent Title: Electrical connector with improved housing
- Patent Title (中): 具有改进外壳的电气连接器
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Application No.: US12156862Application Date: 2008-06-04
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Publication No.: US07798818B2Publication Date: 2010-09-21
- Inventor: Cheng-Chi Yeh , Nan-Hung Lin
- Applicant: Cheng-Chi Yeh , Nan-Hung Lin
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agency: Ming Chieh Chang
- Agent Andrew C. Cheng; Wei Te Chung
- Priority: TW96209154U 20070604
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector (1) for interconnecting integrated circuits (ICs) to a circuit board, includes an insulative housing (2, 3) defining a plurality of passageways extending therethrough, and a plurality of contacts received respectively in each of the passageways of the insulative housing. The insulative housing has a first base (2) adapted to connecting an IC to a circuit board and a second base (3) which is capable of cooperating with said first base when the connector is used to connecting another IC having a different size to the circuit board.
Public/Granted literature
- US20080299795A1 Electrical connector with improved housing Public/Granted day:2008-12-04
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