A paper product with absorbency and moisture strike through resistance is disclosed. More particularly, a multi-ply paper product with improved strike through resistance is disclosed, wherein at least one ply is a wetting resistant ply comprising at least one wetting resistant compound and at least one ply is an absorbent ply possessing greater absorbency than the wetting resistant ply. In addition, a two-ply paper napkin with improved moisture strike through resistance is disclosed, wherein the wetting resistant ply comprises alkyl ketene dimer and the two plies are separately microembossed, glue laminated together in a point to point configuration, and macroembossed with coin edging. Furthermore, a multi-ply paper product with improved strike through resistance is disclosed, wherein a first ply comprises at least one wetting resistant compound and a second ply possesses greater absorbency than the first ply. Methods of making paper products with absorbency and moisture strike through resistance are also described.