发明授权
US07799586B2 Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same 有权
包括发光转换元件的半导体发光器件及其封装方法

Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same
摘要:
Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
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