发明授权
- 专利标题： Methods and apparatus for conducting heat from an electronic assembly while providing shock protection
- 专利标题（中）： 提供冲击保护的从电子组件传导热量的方法和装置
-
申请号： US12167129申请日： 2008-07-02
-
公开(公告)号： US07800065B2公开(公告)日： 2010-09-21
- 发明人: Nicholas Ryan Konkle , Gary McBroom
- 申请人： Nicholas Ryan Konkle , Gary McBroom
- 申请人地址： US NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： US NY Schenectady
- 代理机构： Small Patent Law Group
- 代理商 Dean D. Small
- 主分类号： G01J1/00
- IPC分类号： G01J1/00
摘要：
An apparatus is provided that includes an electronic assembly having a panel and a circuit board, a casing surrounding the electronic assembly and at least one isolated member coupled to the casing. The apparatus further includes a shock absorbing material flexibly coupling the electronic assembly directly or indirectly to the at least one isolated member.
公开/授权文献
信息查询
