Invention Grant
US07800193B2 Photodiode, method for manufacturing such photodiode, optical communication device and optical interconnection module
有权
光电二极管,制造这种光电二极管的方法,光通信装置和光互连模块
- Patent Title: Photodiode, method for manufacturing such photodiode, optical communication device and optical interconnection module
- Patent Title (中): 光电二极管,制造这种光电二极管的方法,光通信装置和光互连模块
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Application No.: US12282959Application Date: 2007-03-08
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Publication No.: US07800193B2Publication Date: 2010-09-21
- Inventor: Junichi Fujikata , Keishi Ohashi
- Applicant: Junichi Fujikata , Keishi Ohashi
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2006-067594 20060313
- International Application: PCT/JP2007/054545 WO 20070308
- International Announcement: WO2007/105593 WO 20070920
- Main IPC: H01L31/108
- IPC: H01L31/108

Abstract:
Both high light receiving sensitivity and high speed of a photodiode are achieved at the same time. The photodiode is provided with a semiconductor layer (1) and a pair of metal electrodes (2) which are arranged on the surface of the semiconductor layer (1) at an interval (d) and form an MSM junction. The interval (d) satisfies the relationship of λ>d>λ/100, where λ is the wavelength of incident light. The metal electrodes (2) can induce surface plasmon. At least one of the electrodes forms a Schottky junction with the semiconductor layer (1), and a low end portion is embedded in the semiconductor layer (1) to a position at a depth less than λ/2n, where n is the refractive index of the semiconductor layer (1).
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