发明授权
- 专利标题: Multi-tiered, expandable panel structures and methods of manufacturing the same
- 专利标题(中): 多层,可扩展面板结构及其制造方法
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申请号: US11826139申请日: 2007-07-12
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公开(公告)号: US07803467B2公开(公告)日: 2010-09-28
- 发明人: Sean C. Dorsy
- 申请人: Sean C. Dorsy
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- 主分类号: B21C27/00
- IPC分类号: B21C27/00
摘要:
A multi-tiered building structure. The multi-tiered building structure includes a panel member having a pattern of cuts, a pattern of legs, and a pattern of tabs configured to move the panel member between a nonexpanded position, wherein the panel member forms a substantially flat shape, and an expanded position, wherein the panel member forms a substantially stepped shape. The building structure also includes a support structure configured to accept at least one of the pattern of tabs of the panel member and maintain the panel member in the expanded position.
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