Invention Grant
- Patent Title: Multilayer amplifier module
- Patent Title (中): 多层放大器模块
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Application No.: US12266733Application Date: 2008-11-07
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Publication No.: US07804365B2Publication Date: 2010-09-28
- Inventor: Christian Korden
- Applicant: Christian Korden
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Fish & Richardson P.C.
- Main IPC: H03F3/14
- IPC: H03F3/14

Abstract:
An amplifier module includes an integrated circuit device including a first amplifier circuit electrically connected to a first input terminal. The amplifier circuit includes a number of x first amplifier branches electrically connected to the first input terminal. The amplifier module also includes a number y of first output terminals each assigned to a respective TX frequency band, a first switching unit that electrically connects one or more of the first amplifier branches to one of the first output terminals, and a multilayer substrate, on top of which the integrated circuit device and the switching unit are mounted. The substrate includes integrated passive matching elements that are part of matching circuits where x≧1 and y≧2. Each of the first amplifier branches is adapted to deliver a different power level at its output and is matched to a load at the first output terminals by one of the matching circuits.
Public/Granted literature
- US20100117738A1 MULTILAYER AMPLIFIER MODULE Public/Granted day:2010-05-13
Information query
IPC分类: