发明授权
US07804695B2 System for interconnecting two substrates each comprising at least one transmission line
有权
用于互连两个基板的系统，每个基板包括至少一个传输线
- 专利标题： System for interconnecting two substrates each comprising at least one transmission line
- 专利标题（中）： 用于互连两个基板的系统，每个基板包括至少一个传输线
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申请号： US12322924申请日： 2009-02-09
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公开(公告)号： US07804695B2公开(公告)日： 2010-09-28
- 发明人: Julian Thevenard , Dominique Lo Hine Tong , Ali Louzir , Corinne Nicolas , Christian Person , Jean-Philippe Coupez
- 申请人： Julian Thevenard , Dominique Lo Hine Tong , Ali Louzir , Corinne Nicolas , Christian Person , Jean-Philippe Coupez
- 申请人地址： FR Boulogne-Billancourt
- 专利权人： Thomson Licensing
- 当前专利权人： Thomson Licensing
- 当前专利权人地址： FR Boulogne-Billancourt
- 代理商 Robert D. Shedd; Harvey D. Fried; James McKenzie
- 优先权： FR0851246 20080227
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H01R12/16 ; H01R12/04
摘要：
The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.