发明授权
- 专利标题: Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces
- 专利标题(中): 具有穿孔的多孔树脂基板的制造方法以及包括具有导电壁面的穿孔的多孔树脂基板的制造方法
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申请号: US11660993申请日: 2005-07-11
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公开(公告)号: US07807066B2公开(公告)日: 2010-10-05
- 发明人: Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
- 申请人: Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
- 申请人地址: JP Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2004-241756 20040823
- 国际申请: PCT/JP2005/012768 WO 20050711
- 国际公布: WO2006/022083 WO 20060203
- 主分类号: B31D3/00
- IPC分类号: B31D3/00
摘要:
A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
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