Invention Grant
- Patent Title: Multi-die apparatus including moveable portions
- Patent Title (中): 多模设备包括可移动部分
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Application No.: US11495363Application Date: 2006-07-28
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Publication No.: US07808061B2Publication Date: 2010-10-05
- Inventor: Peter Hartwell , Carl Picciotto
- Applicant: Peter Hartwell , Carl Picciotto
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L29/82
- IPC: H01L29/82
Abstract:
An electronic apparatus includes a first die, a second die, a third die, and a fourth die, wherein a portion of the second die and a portion of the third die are movably connected between the first die and the fourth die.
Public/Granted literature
- US20080023813A1 Multi-die apparatus including moveable portions Public/Granted day:2008-01-31
Information query
IPC分类:
