发明授权
- 专利标题： Semiconductor package and production method thereof, and semiconductor device
- 专利标题（中）： 半导体封装及其制造方法以及半导体器件
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申请号： US11659468申请日： 2005-05-12
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公开(公告)号： US07808096B2公开(公告)日： 2010-10-05
- 发明人: Hisaho Inao , Tatsuya Hirano , Katsutoshi Shimizu
- 申请人： Hisaho Inao , Tatsuya Hirano , Katsutoshi Shimizu
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2004-230712 20040806
- 国际申请： PCT/JP2005/008697 WO 20050512
- 国际公布： WO2006/013664 WO 20060209
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A semiconductor package production method includes the step of die-cutting part of a lead side portion of a seal formed by molding and dam bars using a pedestal and punch. The pedestal has an outer surface at a position retreating from a side surface of an upper seal portion as far as possible and an inner surface generally near a side surface of a lower seal portion. Width Wa of the upper surface of the upper surface of the pedestal is smaller than the overhang size of the upper seal portion. Tip end region Ra of the lead side portion which is present right under the overhang portion of the upper seal portion has a slanted surface Fa1which is sloped inwardly from top to bottom.
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