发明授权
- 专利标题： 3D smart power module
- 专利标题（中）： 3D智能电源模块
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申请号： US12028051申请日： 2008-02-08
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公开(公告)号： US07808101B2公开(公告)日： 2010-10-05
- 发明人: Yong Liu , Yumin Liu , Hua Yang , Tiburcio A. Maldo , Margie T. Rios
- 申请人： Yong Liu , Yumin Liu , Hua Yang , Tiburcio A. Maldo , Margie T. Rios
- 申请人地址： US ME South Portland
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US ME South Portland
- 代理机构： Hiscock & Barclay, LLP
- 代理商 Thomas R. FitzGerald, Esq.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/34
摘要：
A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.
公开/授权文献
- US20090200657A1 3D SMART POWER MODULE 公开/授权日：2009-08-13
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