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US07808260B2 Probes for a wafer test apparatus 有权
晶圆测试仪的探头

Probes for a wafer test apparatus
Abstract:
A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
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