Invention Grant
- Patent Title: Probes for a wafer test apparatus
- Patent Title (中): 晶圆测试仪的探头
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Application No.: US11885107Application Date: 2006-02-16
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Publication No.: US07808260B2Publication Date: 2010-10-05
- Inventor: Lich Thanh Tran , Edward Lambert Malantonio , Edward T. Laurent , Ilan Hanoon , Dan Mironescu
- Applicant: Lich Thanh Tran , Edward Lambert Malantonio , Edward T. Laurent , Ilan Hanoon , Dan Mironescu
- Applicant Address: US PA Willow Grove
- Assignee: Kulicke And Soffa Industries, Inc.
- Current Assignee: Kulicke And Soffa Industries, Inc.
- Current Assignee Address: US PA Willow Grove
- Agency: Hickman Palermo Truong & Becker LLP
- International Application: PCT/US2006/005362 WO 20060216
- International Announcement: WO2006/091454 WO 20060831
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
Public/Granted literature
- US20080258746A1 Probes for a Wafer Test Apparatus Public/Granted day:2008-10-23
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