Invention Grant
- Patent Title: Thermal compensation of an exponential pair
- Patent Title (中): 指数对的热补偿
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Application No.: US12402388Application Date: 2009-03-11
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Publication No.: US07808298B1Publication Date: 2010-10-05
- Inventor: Eric Modica , Derek Bowers
- Applicant: Eric Modica , Derek Bowers
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Kenyon & Kenyon LLP
- Main IPC: H01L35/00
- IPC: H01L35/00
Abstract:
To compensate for changes in temperature, a pair of bipolar transistors is connected to a voltage divider and receives a differential voltage that varies with temperature. The voltage divider includes a set of resistors placed in parallel. The set of resistors has a resistance that changes with temperature. As the resistance changes with temperature, the differential voltage provided by the voltage divider changes in proportion to a change in thermal voltage.
Public/Granted literature
- US20100231287A1 THERMAL COMPENSATION OF AN EXPONENTIAL PAIR Public/Granted day:2010-09-16
Information query
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