发明授权
- 专利标题： Thermally enhanced electronic package
- 专利标题（中）： 热增强电子封装
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申请号： US12337347申请日： 2008-12-17
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公开(公告)号： US07811862B2公开(公告)日： 2010-10-12
- 发明人: Anwar A. Mohammad , Soon Ing Chew
- 申请人： Anwar A. Mohammad , Soon Ing Chew
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Coats & Bennett, P.L.L.C.
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
According to one embodiment, an electronic package includes a semiconductor die, a heat sink and a metallization layer interposed between the semiconductor die and the heat sink. The metallization layer attaches the semiconductor die to the heat sink. The metallization layer has a thickness of about 5 μm or less and a thermal conductivity of about 60 W/m·K or greater.
公开/授权文献
- US20100148326A1 Thermally Enhanced Electronic Package 公开/授权日：2010-06-17
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