Invention Grant
US07812694B2 Coplanar waveguide integrated circuits having arrays of shield conductors connected by bridging conductors
有权
具有通过桥接导体连接的屏蔽导体阵列的共面波导集成电路
- Patent Title: Coplanar waveguide integrated circuits having arrays of shield conductors connected by bridging conductors
- Patent Title (中): 具有通过桥接导体连接的屏蔽导体阵列的共面波导集成电路
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Application No.: US12061950Application Date: 2008-04-03
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Publication No.: US07812694B2Publication Date: 2010-10-12
- Inventor: Hanyi Ding , Essam F. Mina , Guoan Wang , Wayne H. Woods
- Applicant: Hanyi Ding , Essam F. Mina , Guoan Wang , Wayne H. Woods
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans, LLP
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
Coplanar waveguide structures and design structures for radiofrequency and microwave integrated circuits. The coplanar waveguide structure includes a signal conductor and ground conductors generally coplanar with the signal conductor. The signal conductor is disposed between upper and lower arrays of substantially parallel shield conductors. Conductive bridges, which are electrically isolated from the signal conductor, are located laterally between the signal conductor and each of the ground conductors. Pairs of the conductive bridges connect one of the shield conductors in the first array with one of the shield conductors in the second array to define closed loops encircling the signal line.
Public/Granted literature
- US20090251232A1 COPLANAR WAVEGUIDE STRUCTURES AND DESIGN STRUCTURES FOR RADIOFREQUENCY AND MICROWAVE INTEGRATED CIRCUITS Public/Granted day:2009-10-08
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