发明授权
- 专利标题： Semiconductor-element mounting substrate, semiconductor device, and electronic equipment
- 专利标题（中）： 半导体元件安装基板，半导体器件和电子设备
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申请号： US11607001申请日： 2006-12-01
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公开(公告)号： US07816777B2公开(公告)日： 2010-10-19
- 发明人: Masanori Minamio , Noboru Takeuchi , Kenichi Itou , Toshiyuki Fukuda , Hideki Sakota
- 申请人： Masanori Minamio , Noboru Takeuchi , Kenichi Itou , Toshiyuki Fukuda , Hideki Sakota
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2006-001586 20060106
- 主分类号： H01L21/48
- IPC分类号： H01L21/48
摘要：
A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.
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