The present invention is made with the aim of suppressing heat generation and thus reducing voltage drop, regarding a socket comprising probes to be connected to an electronic device such as an IC package. This is achieved by the socket 6 comprising heatsink components (heatsink plates 74, 76, 201, and 202) disposed adjacent to probes 32, 34, 36 so that the heatsink components move heat of the probes to a heatsink area 84. The socket 6 includes an air layer AL encompassing at least heat-generating portions 104 and 106 in the probes. The heat-generating portions are extended to the side of the socket 6 and heatsink fins (heatsink slit 86) are formed at its end portion. The socket 6 comprises a first probe 32 to be connected with pressure between an electrode (electrode pad 26) of signal system in the electronic device (IC package 4) and an electrode (electrode pad 44) of a signal extraction board 38 corresponding to the signal system; and second probes 34 and 36 to be connected with pressure between electrodes (electrode pads 28 and 30) of power system in the electronic device and an electric conductor (conductive plates 40 and 42) corresponding to the power system.