发明授权
- 专利标题: Mold for nano-imprinting and method of manufacturing the same
- 专利标题(中): 纳米压印模具及其制造方法
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申请号: US11710431申请日: 2007-02-26
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公开(公告)号: US07819652B2公开(公告)日: 2010-10-26
- 发明人: Du Hyun Lee , Jin Seung Sohn , Byung Kyu Lee , Eun Hyoung Cho
- 申请人: Du Hyun Lee , Jin Seung Sohn , Byung Kyu Lee , Eun Hyoung Cho
- 申请人地址: KR Suwon-Si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si
- 代理机构: Sughrue Mion, PLLC
- 优先权: KR10-2006-0088629 20060913
- 主分类号: B29C59/00
- IPC分类号: B29C59/00
摘要:
A nano-imprint mold and a method of manufacturing the same are provided, which can be used for replicating a nano-scaled structure to a polymer layer. The nano-imprint mold comprises: a substrate; a pattern portion having a prominence and depression pattern formed on the substrate; a hard layer formed of a material with a hardness higher than the pattern portion on a surface of the pattern portion; and a separation layer formed on a surface of the hard layer. In the nano-imprint mold of the present invention, an original pattern can be uniformly replicated even on a substrate with an irregular surface. Further, the pattern can be prevented from being damaged by pressure and being contaminated by synthetic resin, resulting in better accuracy and durability of the pattern.