发明授权
- 专利标题: Semiconductor device and manufacturing method thereof
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11784965申请日: 2007-04-10
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公开(公告)号: US07821008B2公开(公告)日: 2010-10-26
- 发明人: Misako Nakazawa , Naoki Makita
- 申请人: Misako Nakazawa , Naoki Makita
- 申请人地址: JP JP
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.,Sharp Kabushiki Kaisha
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.,Sharp Kabushiki Kaisha
- 当前专利权人地址: JP JP
- 代理机构: Husch Blackwell LLP
- 优先权: JP2002-045239 20020221
- 主分类号: H01L29/00
- IPC分类号: H01L29/00 ; H01L21/322
摘要:
A catalytic element is added to an amorphous semiconductor film and heat treatment is conducted therefor to produce a crystalline semiconductor film with good quality, a TFT (semiconductor device) with a satisfactory characteristic is realized using the crystalline semiconductor film. A semiconductor layer includes a region containing an impurity element which has a concentration of 1×1019/cm3 to 1×1021/cm3 and belongs to group 15 of the periodic table and an impurity element which has a concentration of 1.5×1019/cm3 to 3×1021/cm3 and belongs to group 13 of the periodic table, and the region is a region to which a catalytic element left in the semiconductor film (particularly, the channel forming region) moves.
公开/授权文献
- US20070241404A1 Semiconductor device and manufacturing method thereof 公开/授权日:2007-10-18
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