发明授权
- 专利标题: Light-emitting diode and method for fabricating the same
- 专利标题(中): 发光二极管及其制造方法
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申请号: US12426471申请日: 2009-04-20
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公开(公告)号: US07821017B2公开(公告)日: 2010-10-26
- 发明人: Chi-Shen Lee , Su-Hui Lin
- 申请人: Chi-Shen Lee , Su-Hui Lin
- 申请人地址: TW Taichung
- 专利权人: HUGA Optotech Inc.
- 当前专利权人: HUGA Optotech Inc.
- 当前专利权人地址: TW Taichung
- 代理机构: Jianq Chyun IP Office
- 优先权: TW97147142A 20081204
- 主分类号: H01L29/167
- IPC分类号: H01L29/167
摘要:
The invention discloses a method for fabricating a light-emitting diode. In an embodiment of the invention, the method comprises the following steps of (a) preparing a substrate; (b) forming an epitaxial layer on the substrate, wherein the epitaxial layer has an upper surface; (c) forming a mask layer on a first region of the upper surface of the epitaxial layer; (d) forming a semiconductor multi-layer structure on a second region of the upper surface of the epitaxial layer, wherein the second region is distinct from the first region; (e) removing the mask layer formed on the first region of the upper surface of the epitaxial layer; and (f) forming an electrode on the first region of the upper surface of the epitaxial layer.
公开/授权文献
- US20100140629A1 LIGHT-EMITTING DIODE AND METHOD FOR FABRICATING THE SAME 公开/授权日:2010-06-10
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