Invention Grant
- Patent Title: Parts mounting method
- Patent Title (中): 零件安装方法
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Application No.: US11099453Application Date: 2005-04-06
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Publication No.: US07823276B2Publication Date: 2010-11-02
- Inventor: Kazumoto Chiba , Seigo Sato
- Applicant: Kazumoto Chiba , Seigo Sato
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-122179 20040416
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
The present invention provides a printed circuit board that can suppress the positional displacement of parts mounted thereon. The printed circuit board includes resist formed on the surface of the printed circuit board, lands for receiving respective parts to be mounted, the lands being arranged off openings free from the resist, and lands for alignment, respectively alignment marks being formed on the land for alignment by means of solder.
Public/Granted literature
- US20050243536A1 Printed circuit board, parts mounting method and mounting position verifying method Public/Granted day:2005-11-03
Information query
