Invention Grant
- Patent Title: Method for using an in package power supply to supply power to an integrated circuit and to a component
- Patent Title (中): 使用封装电源为集成电路和组件供电的方法
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Application No.: US10113502Application Date: 2002-04-01
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Publication No.: US07823279B2Publication Date: 2010-11-02
- Inventor: Steven R. Eskildsen , Duane R. Mills
- Applicant: Steven R. Eskildsen , Duane R. Mills
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01R43/00
- IPC: H01R43/00
Abstract:
A packaged device may be provided with an in package power supply. The in package power supply may be selectively coupled to another component when the packaged device is not active.
Public/Granted literature
- US20030184963A1 Providing in package power supplies for integrated circuits Public/Granted day:2003-10-02
Information query
