Invention Grant
- Patent Title: Method for connecting at least one wire to a contact element
- Patent Title (中): 用于将至少一根线连接到接触元件的方法
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Application No.: US11631591Application Date: 2005-06-24
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Publication No.: US07823282B2Publication Date: 2010-11-02
- Inventor: Andre Heinzel , Andreas Hojenski
- Applicant: Andre Heinzel , Andreas Hojenski
- Applicant Address: DE
- Assignee: Friatec Aktiengesellschaft
- Current Assignee: Friatec Aktiengesellschaft
- Current Assignee Address: DE
- Agency: Paul, Hastings, Janofsky & Walker LLP
- Priority: DE102004032740 20040707
- International Application: PCT/DE2005/001126 WO 20050624
- International Announcement: WO2006/005291 WO 20060119
- Main IPC: H01R43/04
- IPC: H01R43/04

Abstract:
A method for connecting at least one wire to a contact element to facilitate connection of the wire to a power source comprising the following steps: a) preparation of the contact element which is fitted with a groove for receiving at least one wire; b) insertion of the wire into the groove of the contact element; c) lowering an electrode onto the contact element; and d) heating of the area around the groove by means of the electrode while simultaneously deforming the area around the groove thereby embedding the wire lying in said groove.
Public/Granted literature
- US20080155823A1 Method for Connecting at Least One Wire to a Contact Element Public/Granted day:2008-07-03
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