Invention Grant
US07823322B2 Silicon chip having inclined contact pads and electronic module comprising such a chip
有权
具有倾斜接触焊盘的硅芯片和包括这种芯片的电子模块
- Patent Title: Silicon chip having inclined contact pads and electronic module comprising such a chip
- Patent Title (中): 具有倾斜接触焊盘的硅芯片和包括这种芯片的电子模块
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Application No.: US11937972Application Date: 2007-11-09
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Publication No.: US07823322B2Publication Date: 2010-11-02
- Inventor: Romain Palmade , Agnes Rogge
- Applicant: Romain Palmade , Agnes Rogge
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Agency: Seed IP Law Group PLLC
- Agent Lisa K. Jorgenson; Robert Iannucci
- Priority: FR0504710 20050511
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor chip has an active face in which an integrated circuit region is implanted. The chip includes an inclined lateral contact pad extending beneath the plane of the active face and electrically linked to the integrated circuit region. An electronic module includes a substrate having a cavity in which the chip is arranged. The module can be applied to the production of thin contactless micro-modules for smart cards and contactless electronic badges and tags.
Public/Granted literature
- US20080224320A1 SILICON CHIP HAVING INCLINED CONTACT PADS AND ELECTRONIC MODULE COMPRISING SUCH A CHIP Public/Granted day:2008-09-18
Information query
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