Invention Grant
- Patent Title: Thermal insulation technique for ultra low temperature cryogenic processor
- Patent Title (中): 超低温低温处理器保温技术
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Application No.: US11934696Application Date: 2007-11-02
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Publication No.: US07823394B2Publication Date: 2010-11-02
- Inventor: John Dain , Boyd Bowdish , Nick Henneman
- Applicant: John Dain , Boyd Bowdish , Nick Henneman
- Applicant Address: US UT Orem
- Assignee: Reflect Scientific, Inc.
- Current Assignee: Reflect Scientific, Inc.
- Current Assignee Address: US UT Orem
- Agency: Tran & Associates
- Main IPC: F17C3/08
- IPC: F17C3/08

Abstract:
Systems and methods are disclosed to insulate a vessel includes placing a plurality of shells on all sides of the vessel without providing a direct energy pathway from outer walls of the vessel to the inner walls of the vessel; placing the shells under a vacuum; cryogenically cooling the shells to a cryogenic temperature; and while under vacuum, allowing the shell temperature to rise from the cryogenic temperature to ambient temperature.
Public/Granted literature
- US20090114656A1 THERMAL INSULATION TECHNIQUE FOR ULTRA LOW TEMPERATURE CRYOGENIC PROCESSOR Public/Granted day:2009-05-07
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