Invention Grant
- Patent Title: Die clamp mechanism for press machine
- Patent Title (中): 冲压机模夹机构
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Application No.: US12184552Application Date: 2008-08-01
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Publication No.: US07823435B2Publication Date: 2010-11-02
- Inventor: Eigo Bandou , Katsuhiro Takano
- Applicant: Eigo Bandou , Katsuhiro Takano
- Applicant Address: JP Tokyo
- Assignee: Komatsu Ltd
- Current Assignee: Komatsu Ltd
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2007-201837 20070802
- Main IPC: B21D37/00
- IPC: B21D37/00

Abstract:
A die clamp mechanism includes: a plunger that protrudes from a lower side of a carrier when the carrier on which a bolster is mounted is separated from a bed of a press machine and plunges into the lower side of the carrier when the carrier is grounded on the bed; a biasing member that biases the plunger downward; and an engaging member that engages a die with the bolster in accordance with an axial movement of the plunger when the plunger plunges into the lower side of the carrier.
Public/Granted literature
- US20090031780A1 DIE CLAMP MECHANISM FOR PRESS MACHINE Public/Granted day:2009-02-05
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