Invention Grant
- Patent Title: Cutting table and method for cutting profiled sections
- Patent Title (中): 切割台和切割型材切割方法
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Application No.: US11615016Application Date: 2006-12-22
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Publication No.: US07823493B2Publication Date: 2010-11-02
- Inventor: Heinz-Dieter Witte , Uwe Holzlöhner
- Applicant: Heinz-Dieter Witte , Uwe Holzlöhner
- Applicant Address: DE Hilter
- Assignee: Maschinen Witte GmbH & Co. KG
- Current Assignee: Maschinen Witte GmbH & Co. KG
- Current Assignee Address: DE Hilter
- Agent Gudrun E. Huckett
- Priority: DE102005062305 20051224
- Main IPC: B23D19/04
- IPC: B23D19/04

Abstract:
A cutting table arrangement for profiled sections to be joined at a predetermined angular position at miter cuts. The cutting table arrangement has a cutting table, an angle-adjustable cutting device arranged on the cutting table, a first holding device arranged on the cutting table for holding a first straight profiled section in alignment with the first cutting device, and at least one second holding device for a second profiled section that is to be secured in a predetermined position and at a predetermined angle relative to the first profiled section on the cutting table. A first marking aid is provided at the first holding device for providing an aligned lateral extension toward the second profiled section. A second marking aid is provided for indicating the cutting line correlated to the first cutting device.
Public/Granted literature
- US20070144320A1 Cutting Table and Method for Cutting Profiled Sections Public/Granted day:2007-06-28
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